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Endwave's technical team has broad expertise in semiconductor device physics, RF, microwave and millimeterwave circuit and component design, firmware and software development, mechanical packaging, system engineering, test engineering and other critical disciplines. We have a keen understanding of how our module behavior impacts overall RF system performance, and conversely how system and subsystem level requirements flow down to those imposed upon our products. When collaborating with your engineering teams on new product design, we'll communicate vital cost vs. performance tradeoffs that will help guide your overall development strategy.
Endwave engineers use the latest computer simulation and CAD tools to predict subtle but critical performance differences amongst various design options. As a result, we avoid the "cut and try" approach that characterizes much of the high-frequency industry. The use of automated test kits allows for thorough and rapid characterization of new designs. This, along with employing strict Design for Manufacturability (DFM) techniques in our development procedures, ensures a smooth handoff from prototyping to production.
- Electrical Design Tools: HFSS™, IE3D™, Microwave Office™, ADS™, Eagleware™
- Mechanical Design Tools: SolidWorks™, Cosmos™, Allegro™, EPD™ and AutoCad™
- Test Software: HP Vee™, LabView™
In high-frequency RF modules, the choice and implementation of the basic circuit technology determines the performance, cost and manufacturability of the product. Most of our products employ monolithic microwave integrated circuit (MMIC) technology. In many cases, we apply our circuit design capabilities and experience to develop custom circuits that are optimized for cost, performance and manufacturability. To learn more, view our Custom MMICs and Proprietary Technology pages.
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