Endwave has developed an integrated transceiver mechanical packaging solution that is designed to eliminate 30% of the typical cost, while preserving 100% of the electrical performance of microwave and millimeterwave transceivers. The proprietary packaging technique used is called Epsilon Packaging™. In addition to cost reduction, Epsilon Packaging significantly reduces the size and weight of a typical transceiver subassembly. This is accomplished by replacing machined metal mechanical components with plated FR-4 and injection molded metalized plastics. The Epsilon Packaging approach also enables mixed technology integration, allowing MMIC, chip-on-board (COB), and surface mount technology (SMT) components to co-exist, thus easing assembly and yielding further cost reductions. Crosstalk between receiver and transmitter sections has been addressed through a sophisticated isolation trenching technique, while reflow issues have been resolved through extensive temperature profiling and new plating and assembly methods.
Endwave transceiver solutions with Epsilon Packaging are geared towards microwave and millimeter-wave applications, where low cost, light weight, and small form-factor are essential. They are available with a variety of input/output connector options including edge mount, coax, waveguide, and various DC connector harnesses. Custom engineered options include on-board local oscillators, LO frequency multiplier chains (X2 to X12), provision for loop-back and/or BIT detection, higher output power, and other functionality. Operating temperature range is -45° to +85° C. Typical applications include homeland security sensors, point-to-point radio, battlefield communications, and intelligent automotive cruise control radars. The Epsilon Packaging approach is also available in amplifiers, switches mixers, multipliers, and custom-designed multi-function assemblies.
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An integrated transceiver board produced with Epsilon Packaging reflects the following typical performance characteristics at 24 GHz:
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Receiver noise figure < 5 dB |
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Transmit Output Power > +27 dBm |
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Transmit/Receive isolation > 70 dB |
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MTBF > 50 years |
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